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Patent Assignment Details
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Reel/Frame:062223/0930   Pages: 3
Recorded: 12/28/2022
Attorney Dkt #:031175.0032
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18013365
Filing Dt:
12/28/2022
Publication #:
Pub Dt:
03/21/2024
Title:
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE PREPARATION METHOD, AND SEMICONDUCTOR PACKAGE PREPARATION METHOD
Assignor
1
Exec Dt:
12/27/2022
Assignee
1
3000 SKC DRIVE
COVINGTON, GEORGIA 30014
Correspondence name and address
NSIP LAW
P.O. BOX 65745
WASHINGTON, DC 20035

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