Patent Assignment Details
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| Reel/Frame: | 012355/0931 | |
| Pages: | 2 |
| | Recorded: | 11/14/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/17/2004
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Application #:
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10003580
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Filing Dt:
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11/14/2001
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Publication #:
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Pub Dt:
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02/27/2003
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Title:
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METHOD OF FABRICATING A SUBSTRATE-BASED SEMICONDUCTOR PACKAGE WITHOUT MOLD FLASH
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Assignee
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD.
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SUITE A1
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SUNNYVALE, CA 94087
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