Patent Assignment Details
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Reel/Frame: | 013836/0931 | |
| Pages: | 5 |
| | Recorded: | 07/28/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/10/2004
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Application #:
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10434256
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Filing Dt:
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05/07/2003
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Publication #:
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Pub Dt:
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04/22/2004
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Title:
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HEAT SPREADERS, HEAT SPREADER PACKAGES, AND FABRICATION METHODS FOR USE WITH FLIP CHIP SEMICONDUCTOR DEVICES
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Assignee
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5 YISHUN ST. 23 |
SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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MIKIO ISHIMARU
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1110 SUNNYVALE-SARATOGA RD.
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SUITE A1
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SUNNYVALE, CA 94087
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