Patent Assignment Details
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Reel/Frame: | 022292/0931 | |
| Pages: | 3 |
| | Recorded: | 02/22/2009 | | |
Attorney Dkt #: | 5182-018 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/10/2012
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Application #:
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12438362
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Filing Dt:
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02/22/2009
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Publication #:
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Pub Dt:
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09/16/2010
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Title:
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FLIP CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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Assignee
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654-2, GAK-RI, OCHANG-MYUN, CHEONGWON-GUN, |
CHUNGBUK, 363-883, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF |
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Correspondence name and address
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HOSOON LEE
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9600 SW OAK ST. SUITE 525
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TIGARD, OR 97223
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