Patent Assignment Details
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Reel/Frame: | 026185/0932 | |
| Pages: | 4 |
| | Recorded: | 04/27/2011 | | |
Attorney Dkt #: | 22171-00128 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13094944
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Filing Dt:
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04/27/2011
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Publication #:
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Pub Dt:
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11/01/2012
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Title:
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INTEGRATED CIRCUIT STRUCTURE INCLUDING A COPPER-ALUMINUM INTERCONNECT AND METHOD FOR FABRICATING THE SAME
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Assignee
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HWA-YA TECHNOLOGY PARK 669, FUHSING 3 ROAD |
KUEISHAN, TAIWAN |
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Correspondence name and address
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ZHUN LU
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P O BOX 2207
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WILMINGTON, DE 19899
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