Patent Assignment Details
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Reel/Frame: | 064358/0934 | |
| Pages: | 4 |
| | Recorded: | 07/24/2023 | | |
Attorney Dkt #: | 010829.9570.US01 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18225369
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Filing Dt:
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07/24/2023
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Publication #:
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Pub Dt:
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11/16/2023
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Title:
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SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR MANAGING HIGH DIE STACK STRUCTURES
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Assignee
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8000 S. FEDERAL WAY |
P.O. BOX 6 |
BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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PO BOX 1247
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SEATTLE, WA 98111-1247
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