Patent Assignment Details
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| Reel/Frame: | 021017/0937 | |
| Pages: | 7 |
| | Recorded: | 04/15/2008 | | |
| Attorney Dkt #: | 27-483 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE DATE THAT THE THIRD ASSIGNOR (HYUN JOUNG KIM) EXECUTED THE ASSIGNMENT PREVIOUSLY RECORDED ON REEL 020793 FRAME 0032. ASSIGNOR(S) HEREBY CONFIRMS THE DATE OF ASSIGNMENT EXECUTION BY THE THIRD ASSIGNOR (HYUN JOUNG KIM) |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/30/2010
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Application #:
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12101961
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Filing Dt:
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04/11/2008
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Publication #:
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Pub Dt:
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10/15/2009
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Title:
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INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH CENTRAL BOND WIRES
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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MIKIO ISHIMARU
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LAW OFFICE OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL, SUITE # 330
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SUNNYVALE, CALIFORNIA 94087
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