Patent Assignment Details
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| Reel/Frame: | 029486/0937 | |
| Pages: | 3 |
| | Recorded: | 12/18/2012 | | |
| Attorney Dkt #: | SEMI/0037US.C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/12/2014
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Application #:
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13624656
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Filing Dt:
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09/21/2012
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Publication #:
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Pub Dt:
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03/27/2014
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Title:
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METHOD FOR HANDLING A SEMICONDUCTOR WAFER ASSEMBLY
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Assignee
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| 3F, NO. 11, KE JUNG RD., CHU-NAN SITE |
| HSINCHU SCIENCE PARK |
| CHU-NAN 350, MIAO-LI COUNTY, TAIWAN |
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Correspondence name and address
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PATTERSON & SHERIDAN, LLP
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3040 POST OAK BLVD.
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SUITE 1500
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HOUSTON, TX 77056
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