Patent Assignment Details
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| Reel/Frame: | 010534/0940 | |
| Pages: | 3 |
| | Recorded: | 01/21/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/19/2002
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Application #:
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09489167
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Filing Dt:
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01/21/2000
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Title:
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Ball grid array integrated circuit package structure
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Assignee
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| NO. 123, SEC. 3, DA FONG ROAD TANTZU |
| TAICHUNG, TAIWAN R.O.C |
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Correspondence name and address
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DIKE, BRONSTEIN, ROBERTS & CUSHMAN
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ATTN: PETER F. CORLESS, ESQ.
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130 WATER STREET
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BOSTON, MA 02109
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