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02/07/2008
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10/01/2009
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11/12/2009
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13491036
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Filing Dt:
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06/07/2012
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Pub Dt:
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09/27/2012
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Title:
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SEMICONDUCTOR DEVICES HAVING TENSILE AND/OR COMPRESSIVE STRAIN AND METHODS OF MANUFACTURING AND DESIGN STRUCTURE
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11/26/2013
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13529389
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06/21/2012
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10/18/2012
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Title:
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REDUNDANT METAL BARRIER STRUCTURE FOR INTERCONNECT APPLICATIONS
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07/15/2014
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13530887
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06/22/2012
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10/18/2012
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Title:
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INTEGRATION OF FIN-BASED DEVICES AND ETSOI DEVICES
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10/15/2013
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13537879
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06/29/2012
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Pub Dt:
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10/18/2012
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Title:
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INTERCONNECT STRUCTURE CONTAINING VARIOUS CAPPING MATERIALS FOR ELECTRICAL FUSE AND OTHER RELATED APPLICATIONS
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Patent #:
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06/10/2014
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13550919
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07/17/2012
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11/15/2012
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Title:
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CONTROL OF FLATBAND VOLTAGES AND THRESHOLD VOLTAGES IN HIGH-K METAL GATE STACKS AND STRUCTURES FOR CMOS DEVICES
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10/29/2013
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13552296
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07/18/2012
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11/08/2012
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Title:
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DEVICE HAVING AND METHOD FOR FORMING FINS WITH MULTIPLE WIDTHS
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12/02/2014
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13554305
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07/20/2012
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11/08/2012
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Title:
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Self-Aligned Contacts for Field Effect Transistor Devices
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06/03/2014
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13605144
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09/06/2012
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01/24/2013
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Title:
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BORDERLESS CONTACTS IN SEMICONDUCTOR DEVICES
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04/22/2014
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13607677
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09/08/2012
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Pub Dt:
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12/27/2012
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Title:
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BORDERLESS INTERCONNECT LINE STRUCTURE SELF-ALIGNED TO UPPER AND LOWER LEVEL CONTACT VIAS
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NONE
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13617060
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09/14/2012
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Pub Dt:
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01/03/2013
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Title:
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INTERCONNECT STRUCTURE CONTAINING A METALLIC INTERFACIAL LAYER LOCATED AT A BOTTOM OF A VIA OPENING
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NONE
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13617280
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09/14/2012
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01/10/2013
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Title:
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DEVICE HAVING AND METHOD FOR FORMING FINS WITH MULTIPLE WIDTHS
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08/27/2013
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13628169
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09/27/2012
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01/24/2013
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Title:
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RECESSED CONTACT FOR MULTI-GATE FET OPTIMIZING SERIES RESISTANCE
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04/19/2016
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13628561
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09/27/2012
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01/24/2013
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Title:
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FINFET SPACER FORMATION BY ORIENTED IMPLANTATION
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07/01/2014
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13664955
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10/31/2012
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05/01/2014
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Title:
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INSULATIVE CAP FOR BORDERLESS SELF-ALIGNING CONTACT IN SEMICONDUCTOR DEVICE
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08/12/2014
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13666386
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11/01/2012
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Pub Dt:
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05/01/2014
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Title:
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FIN FIELD EFFECT TRANSISTORS HAVING A NITRIDE CONTAINING SPACER TO REDUCE LATERAL GROWTH OF EPITAXIALLY DEPOSITED SEMICONDUCTOR MATERIALS
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07/01/2014
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13674225
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11/12/2012
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05/01/2014
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Title:
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INSULATIVE CAP FOR BORDERLESS SELF-ALIGNING CONTACT IN SEMICONDUCTOR DEVICE
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12/02/2014
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13674498
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11/12/2012
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05/15/2014
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Title:
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METHOD OF MANUFACTURING AN ENHANCED ELECTROMIGRATION PERFORMANCE HETERO-JUNCTION BIPOLAR TRANSISTOR
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09/16/2014
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13736294
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01/08/2013
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Pub Dt:
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07/10/2014
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Title:
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METHODS OF FORMING BULK FINFET DEVICES BY PERFORMING A RECESSING PROCESS ON LINER MATERIALS TO DEFINE DIFFERENT FIN HEIGHTS AND FINFET DEVICES WITH SUCH RECESSED LINER MATERIALS
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08/26/2014
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13747683
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01/23/2013
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07/24/2014
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Title:
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FINFET DEVICE FORMATION
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06/03/2014
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13767845
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02/14/2013
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06/20/2013
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Title:
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SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
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05/05/2015
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13774573
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02/22/2013
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07/04/2013
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Title:
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BODY CONTACTED HYBRID SURFACE SEMICONDUCTOR-ON-INSULATOR DEVICES
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04/08/2014
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13780471
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02/28/2013
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Pub Dt:
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07/04/2013
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Title:
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INTERCONNECT STRUCTURE CONTAINING VARIOUS CAPPING MATERIALS FOR PROGRAMMABLE ELECTRICAL FUSES
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NONE
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13871337
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04/26/2013
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09/12/2013
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Title:
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INTERCONNECT STRUCTURE FOR IMPROVED TIME DEPENDENT DIELECTRIC BREAKDOWN
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02/24/2015
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13933191
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07/02/2013
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11/14/2013
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Title:
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SIMULTANEOUS FORMATION OF FINFET AND MUGFET
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02/17/2015
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13933356
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07/02/2013
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10/31/2013
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Title:
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FORMATION OF MULTI-HEIGHT MUGFET
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12/30/2014
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14069282
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10/31/2013
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02/27/2014
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Title:
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SEMICONDUCTOR DEVICE HAVING A COPPER PLUG
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12/02/2014
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14073366
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11/06/2013
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03/06/2014
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Title:
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HIGH PERFORMANCE NON-PLANAR SEMICONDUCTOR DEVICES WITH METAL FILLED INTER-FIN GAPS
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03/03/2015
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14149295
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01/07/2014
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05/01/2014
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Title:
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FIN-LAST REPLACEMENT METAL GATE FINFET
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05/10/2016
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14157851
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01/17/2014
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05/15/2014
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FINFET SPACER FORMATION BY ORIENTED IMPLANTATION
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NONE
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14188028
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02/24/2014
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06/19/2014
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CONTINUOUS METAL SEMICONDUCTOR ALLOY VIA FOR INTERCONNECTS
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06/16/2015
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14195272
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03/03/2014
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06/26/2014
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FINFET DEVICE
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05/19/2015
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14294319
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06/03/2014
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09/18/2014
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Title:
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FIN FIELD EFFECT TRANSISTORS HAVING A NITRIDE CONTAINING SPACER TO REDUCE LATERAL GROWTH OF EPITAXIALLY DEPOSITED SEMICONDUCTOR MATERIALS
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06/16/2015
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14296522
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06/05/2014
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09/25/2014
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FINFET DEVICE FORMATION
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04/07/2015
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14333683
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07/17/2014
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11/06/2014
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FINFET DEVICES HAVING RECESSED LINER MATERIALS TO DEFINE DIFFERENT FIN HEIGHTS
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06/07/2016
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14515925
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10/16/2014
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02/05/2015
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SEMICONDUCTOR DEVICES WITH ENHANCED ELECTROMIGRATION PERFORMANCE
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06/06/2017
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14529431
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10/31/2014
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02/26/2015
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Title:
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INTERCONNECT STRUCTURE WITH ENHANCED RELIABILITY
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