Patent Assignment Details
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Reel/Frame: | 006210/0941 | |
| Pages: | 5 |
| | Recorded: | 08/31/1992 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/07/1993
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Application #:
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07938074
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Filing Dt:
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08/31/1992
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Title:
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ETCHING PROCESSES FOR AVOIDING EDGE STRESS IN SEMICONDUCTOR CHIP SOLDER BUMPS
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Correspondence name and address
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I B M
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HAROLD HUBERFELD
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DEPT. 34H/BLDG. 300-482
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EAST FISHKILL FACILITY - ROUTE 52
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HOPEWELL JUNCTION, NEW YORK 12533
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