Patent Assignment Details
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| Reel/Frame: | 052149/0941 | |
| Pages: | 4 |
| | Recorded: | 03/18/2020 | | |
| Attorney Dkt #: | 992_001 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/16/2021
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Application #:
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16807677
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Filing Dt:
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03/03/2020
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Publication #:
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Pub Dt:
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07/02/2020
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Title:
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CONNECTION STRUCTURE FOR WIRING SUBSTRATE AND FLEXIBLE SUBSTRATE AND PACKAGE FOR HOUSING ELECTRONIC COMPONENTS
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Assignees
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| 2701-1, AZA IWAKURA, OMINECHO HIGASHIBUN |
| MINE-SHI, YAMAGUCHI, JAPAN 759-2212 |
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| 2-56, SUDA-CHO, MIZUHO-KU |
| NAGOYA-CITY, PREFECTURE, JAPAN 467-8530 |
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Correspondence name and address
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BURR & BROWN, PLLC
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PO BOX 869
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FAYETTEVILLE, NY 13066
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05/30/2024 11:10 AM
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