Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 027082/0944 | |
| Pages: | 4 |
| | Recorded: | 10/18/2011 | | |
| Attorney Dkt #: | 27-127 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE DATE EXECUTED BY THE ASSIGNOR PREVIOUSLY RECORDED ON REEL 016759 FRAME 0319. ASSIGNOR(S) HEREBY CONFIRMS THE EXECUTED DATE BY THE ASSIGNOR IS 9/30/2005. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/10/2012
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Application #:
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11164088
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Filing Dt:
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11/10/2005
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Publication #:
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Pub Dt:
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08/17/2006
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Title:
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METHOD OF MANUFACTURING NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING ETCHED DIFFERENTIAL HEIGHT LEAD STRUCTURES
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Assignee
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| 5 YISHUN STREET 23 |
| SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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MIKIO ISHIMARU
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LAW OFFICES OF MIKIO ISHIMARU
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2055 GATEWAY PLACE, SUITE 700
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SAN JOSE, CA 95110
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