Total properties:
20
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Patent #:
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Issue Dt:
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03/18/1997
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Application #:
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08421801
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Filing Dt:
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04/13/1995
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Title:
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CHIP STACK AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
|
02/09/1999
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Application #:
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08971499
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Filing Dt:
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11/17/1997
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Title:
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MODULAR PANEL STACKING PROCESS
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Patent #:
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Issue Dt:
|
04/24/2001
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Application #:
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09298664
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Filing Dt:
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04/23/1999
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Title:
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UNIVERSAL PACKAGE AND METHOD OF FORMING THE SAME
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Patent #:
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Issue Dt:
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11/27/2001
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Application #:
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09305584
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Filing Dt:
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05/05/1999
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Title:
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STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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07/17/2001
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Application #:
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09482294
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Filing Dt:
|
01/13/2000
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Title:
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STACKABLE CHIP PACKAGE WITH FLEX CARRIER
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Patent #:
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Issue Dt:
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08/20/2002
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Application #:
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09535641
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Filing Dt:
|
03/24/2000
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Title:
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CSP STACKING TECHNOLOGY USING RIGID/FLEX CONSTRUCTION
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Patent #:
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Issue Dt:
|
02/26/2002
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Application #:
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09574321
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Filing Dt:
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05/19/2000
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Title:
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Stackable flex circuit chip package and method of making same
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Patent #:
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Issue Dt:
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05/22/2001
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Application #:
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09594363
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Filing Dt:
|
06/15/2000
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Title:
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Chip stack with active cooling system
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Patent #:
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Issue Dt:
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06/11/2002
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Application #:
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09598343
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Filing Dt:
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06/21/2000
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Title:
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PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
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Patent #:
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Issue Dt:
|
03/26/2002
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Application #:
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09664938
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Filing Dt:
|
09/19/2000
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Title:
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method of forming universal package
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Patent #:
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Issue Dt:
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10/29/2002
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Application #:
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09826621
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Filing Dt:
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04/05/2001
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Publication #:
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Pub Dt:
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12/27/2001
| | | | |
Title:
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THREE-DIMENSIONAL MEMORY STACKING USING ANISOTROPIC EPOXY INTERCONNECTIONS
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Patent #:
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Issue Dt:
|
10/29/2002
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Application #:
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09838773
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Filing Dt:
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04/19/2001
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Publication #:
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Pub Dt:
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08/23/2001
| | | | |
Title:
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STACKABLE CHIP PACKAGE WITH FLEX CARRIER
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Patent #:
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Issue Dt:
|
07/30/2002
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Application #:
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09888785
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Filing Dt:
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06/25/2001
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Publication #:
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|
Pub Dt:
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11/01/2001
| | | | |
Title:
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STACKABLE FLEX CIRCUIT CHIP PACKAGE AND METHOD OF MAKING SAME
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Patent #:
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Issue Dt:
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02/04/2003
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Application #:
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09888792
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Filing Dt:
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06/25/2001
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Publication #:
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Pub Dt:
|
04/25/2002
| | | | |
Title:
|
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
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|
|
Patent #:
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|
Issue Dt:
|
09/30/2003
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Application #:
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09912010
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Filing Dt:
|
07/24/2001
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Publication #:
|
|
Pub Dt:
|
01/30/2003
| | | | |
Title:
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CHIP STACK WITH DIFFERING CHIP PACKAGE TYPES
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|
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Patent #:
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|
Issue Dt:
|
04/08/2003
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Application #:
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09922977
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Filing Dt:
|
08/06/2001
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Publication #:
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|
Pub Dt:
|
12/27/2001
| | | | |
Title:
|
PANEL STACKING OF BGA DEVICES TO FORM THREE-DIMENSIONAL MODULES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2003
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Application #:
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09957190
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Filing Dt:
|
09/20/2001
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Publication #:
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|
Pub Dt:
|
03/20/2003
| | | | |
Title:
|
POST IN RING INTERCONNECT USING FOR 3-D STACKING
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|
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Patent #:
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|
Issue Dt:
|
06/21/2005
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Application #:
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10263859
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Filing Dt:
|
10/03/2002
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Publication #:
|
|
Pub Dt:
|
02/06/2003
| | | | |
Title:
|
CHIP STACK WITH DIFFERING CHIP PACKAGE TYPES
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|
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Patent #:
|
|
Issue Dt:
|
05/15/2007
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Application #:
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10900073
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Filing Dt:
|
07/27/2004
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Title:
|
STACKABLE FLEX CIRCUIT IC PACKAGE AND METHOD OF MAKING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
12/15/2009
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Application #:
|
10974046
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Filing Dt:
|
10/26/2004
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Title:
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STACKABLE CHIP PACKAGE WITH FLEX CARRIER
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|