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Patent Assignment Details
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Reel/Frame:014408/0946   Pages: 2
Recorded: 08/18/2003
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/07/2006
Application #:
10643043
Filing Dt:
08/18/2003
Publication #:
Pub Dt:
02/24/2005
Title:
ELECTRONIC ASSEMBLY WITH SOLDER-BONDED HEAT SINK
Assignors
1
Exec Dt:
08/12/2003
2
Exec Dt:
08/12/2003
Assignee
1
P.O. BOX 5052
LEGAL STAFF - MAIL CODE: 480-410-202
TROY, MICHIGAN
Correspondence name and address
DELPHI TECHNOLOGIES, INC.
STEFAN V. CHMIELEWSKI
P.O. BOX 9005
LEGAL STAF MC CT10C
KOKOMO, IN 46904-9005

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