Patent Assignment Details
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Reel/Frame: | 014408/0946 | |
| Pages: | 2 |
| | Recorded: | 08/18/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/07/2006
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Application #:
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10643043
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Filing Dt:
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08/18/2003
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Publication #:
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Pub Dt:
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02/24/2005
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Title:
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ELECTRONIC ASSEMBLY WITH SOLDER-BONDED HEAT SINK
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Assignee
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P.O. BOX 5052 |
LEGAL STAFF - MAIL CODE: 480-410-202 |
TROY, MICHIGAN |
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Correspondence name and address
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DELPHI TECHNOLOGIES, INC.
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STEFAN V. CHMIELEWSKI
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P.O. BOX 9005
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LEGAL STAF MC CT10C
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KOKOMO, IN 46904-9005
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