Patent Assignment Details
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| Reel/Frame: | 058296/0946 | |
| Pages: | 4 |
| | Recorded: | 10/18/2021 | | |
| Attorney Dkt #: | 095714-1554 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/11/2023
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Application #:
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17504207
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Filing Dt:
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10/18/2021
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Publication #:
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Pub Dt:
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02/03/2022
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Title:
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METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PACKAGING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SHALLOW TRENCH ISOLATION (STI)
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Assignee
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| NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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THE MCDERMOTT BUILDING
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500 NORTH CAPITOL STREET NW
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WASHINGTON, DC 20001
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