Patent Assignment Details
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| Reel/Frame: | 012981/0947 | |
| Pages: | 6 |
| | Recorded: | 06/03/2002 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10161430
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Filing Dt:
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06/03/2002
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Publication #:
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Pub Dt:
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12/04/2003
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Title:
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Flip chip packaging process using laser-induced metal bonding technology, system utilizing the method, and device created by the method
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Assignees
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| POSTFACH 30 02 20 |
| D-70442 STUTTGART, GERMANY |
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| 1768 AUTOMATION PARKWAY |
| SAN JOSE, CALIFORNIA 95131 |
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Correspondence name and address
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KENYON & KENYON
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RICHARD L. MAYER
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ONE BROADWAY
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NEW YORK, NEW YORK 10004
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