Patent Assignment Details
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Reel/Frame: | 006920/0948 | |
| Pages: | 3 |
| | Recorded: | 02/15/1994 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/09/1995
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Application #:
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08169117
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Filing Dt:
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12/21/1993
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Title:
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METHOD OF BONDING SILICON WAFERS AT TEMPERATURES BELOW 500 DEGREES CENTIGRADE FOR SENSOR APPLICATIONS
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Assignee
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ERC BLDG. D-32 |
KOKOMO, INDIANA 46904 |
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Correspondence name and address
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DELCO ELECTRONICS CORPORATION
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JIMMY L. FUNKE
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ERC BLDG., M.S. D-32
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KOKOMO, IN 46904
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