Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 015957/0948 | |
| Pages: | 3 |
| | Recorded: | 11/04/2004 | | |
Attorney Dkt #: | 3167/7 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/11/2008
|
Application #:
|
10980168
|
Filing Dt:
|
11/04/2004
|
Publication #:
|
|
Pub Dt:
|
09/01/2005
| | | | |
Title:
|
LOW COEFFICIENT OF THERMAL EXPANSION BUILD-UP LAYER PACKAGING AND METHOD THEREOF
|
|
Assignee
|
|
|
8F, NO. 535 |
CHUNG CHENG RD., HSIN TIEN CITY |
TAIPEI HSIEN, TAIWAN R.O.C. |
|
Correspondence name and address
|
|
DENNISON, SCHULTZ, DOUGHERTY & MACDONALD
|
|
1727 KING STREET
|
|
SUITE 105
|
|
ALEXANDRIA, VA 22314
|
Search Results as of:
09/26/2024 09:50 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|