Patent Assignment Details
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Reel/Frame: | 010627/0949 | |
| Pages: | 3 |
| | Recorded: | 03/09/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/05/2002
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Application #:
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09522175
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Filing Dt:
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03/09/2000
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Title:
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Manufacturing method of semiconductor devices by using dry etching technology
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Assignee
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72 HORIKAWA-CHO, SAIWAI-KU |
KAWASAKI-SHI, JAPAN |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW, ET AL.
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ERNEST F. CHAPMAN
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1300 I STREET, NW
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WASHINGTON, DC 20005-3315
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