Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 017586/0949 | |
| Pages: | 6 |
| | Recorded: | 05/08/2006 | | |
Conveyance: | RE-RECORD ASSIGNMENT TO CORRECT STREET ADDRESS OF RECEIVING PARTY PREVIOUSLY RECORDED AT REEL/FRAME 017507/0691 |
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Total properties:
11
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Patent #:
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Issue Dt:
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10/03/1995
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Application #:
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07962222
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Filing Dt:
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08/20/1993
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Title:
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METHODS FOR PRODUCING PACKAGED INTEGRATED CIRCUIT DEVICES AND PACKAGEDINTEGRATED CIRCUIT DEVICES PRODUCED THEREBY
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Patent #:
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Issue Dt:
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08/20/1996
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Application #:
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08274251
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Filing Dt:
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07/13/1994
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Title:
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METHODS FOR PRODUCING INTERGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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02/10/1998
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Application #:
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08602853
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Filing Dt:
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06/17/1996
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Title:
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METHOD AND APPARATUS FOR PRODUCING INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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09/12/2000
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Application #:
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08681598
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Filing Dt:
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07/29/1996
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Title:
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METHODS OF PRODUCING INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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03/21/2000
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Application #:
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08682556
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Filing Dt:
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08/19/1996
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Title:
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METHODS AND APPARATUS FOR PRODUCING INTEGRATED CIRCUIT DEVICES
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Patent #:
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Issue Dt:
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02/08/2000
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Application #:
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08765473
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Filing Dt:
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02/21/1997
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Title:
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PROCESS FOR MANUFACTURING SOLDER LEADS ON A SEMICONDUCTOR DEVICE PACKAGE
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Patent #:
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Issue Dt:
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11/09/1999
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Application #:
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08952019
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Filing Dt:
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02/27/1998
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Title:
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BONDING MACHINE
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Patent #:
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Issue Dt:
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11/11/2003
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Application #:
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09601895
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Filing Dt:
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09/22/2000
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Title:
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INTEGRATED CIRCUIT DEVICE
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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09725166
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Filing Dt:
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11/29/2000
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Publication #:
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Pub Dt:
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08/30/2001
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Title:
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METHODS FOR PRODUCING PACKAGED INTEGRATED CIRCUIT DEVICES & PACKAGED INTEGRATED CIRCUIT DEVICES PRODUCED THEREBY
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Patent #:
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Issue Dt:
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09/23/2003
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Application #:
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09758906
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Filing Dt:
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01/11/2001
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Publication #:
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Pub Dt:
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05/01/2003
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Title:
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PACKAGED INTEGRATED CIRCUITS AND METHODS OF PRODUCING THEREOF
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Patent #:
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Issue Dt:
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12/06/2005
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Application #:
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10462576
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Filing Dt:
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06/16/2003
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Publication #:
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Pub Dt:
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12/16/2004
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Title:
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METHODS AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES
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Assignee
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1126 BUDAPEST |
UGOCSA U. 4/B |
BUDAPEST, HUNGARY |
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Correspondence name and address
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MARCUS J. MILLET
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LERNER, DAVID, LITTENBERG,
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KRUMHOLZ & MENTLIK, LLP
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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