Patent Assignment Details
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Reel/Frame: | 020500/0949 | |
| Pages: | 4 |
| | Recorded: | 02/13/2008 | | |
Attorney Dkt #: | MT10712AK |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/20/2010
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Application #:
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12030213
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Filing Dt:
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02/13/2008
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Publication #:
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Pub Dt:
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08/13/2009
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Title:
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INTEGRATED CIRCUIT DIE, INTEGRATED CIRCUIT PACKAGE, AND PACKAGING METHOD
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Assignee
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6501 WILLIAM CANNON DRIVE WEST |
LAW DEPARTMENT |
AUSTIN, TEXAS 78735 |
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Correspondence name and address
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JESLYN GOH
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10 ANG MO KIO STREET 65
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#03-01/03, TECHPOINT
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SINGAPORE, 569059 SINGAPORE
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