Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 029856/0953 | |
| Pages: | 3 |
| | Recorded: | 02/22/2013 | | |
Attorney Dkt #: | LAMRP016/NVLS003802 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
1
|
|
Patent #:
|
|
Issue Dt:
|
08/09/2016
|
Application #:
|
13744335
|
Filing Dt:
|
01/17/2013
|
Publication #:
|
|
Pub Dt:
|
07/17/2014
| | | | |
Title:
|
TREATMENT METHOD OF ELECTRODEPOSITED COPPER FOR WAFER-LEVEL-PACKAGING PROCESS FLOW
|
|
Assignee
|
|
|
4650 CUSHING PARKWAY |
FREMONT, CALIFORNIA 94538 |
|
Correspondence name and address
|
|
WEAVER AUSTIN VILLENEUVE & SAMPSON LLP
|
|
P.O. BOX 70250
|
|
OAKLAND, CA 94612-0250
|
Search Results as of:
09/24/2024 01:57 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|