Patent Assignment Details
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Reel/Frame: | 048347/0953 | |
| Pages: | 5 |
| | Recorded: | 02/15/2019 | | |
Attorney Dkt #: | 092977D1C4 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/04/2011
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Application #:
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11930998
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Filing Dt:
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10/31/2007
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Publication #:
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Pub Dt:
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02/28/2008
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Title:
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LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP
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Assignee
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NO. 47, PARK 2ND RD. SCIENCE-BASED INDUSTRIAL PARK |
ROOM 301/302 |
HSINCHU, TAIWAN |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DRIVE
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SAN DIEGO, CA 92121
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