Patent Assignment Details
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| Reel/Frame: | 046840/0954 | |
| Pages: | 5 |
| | Recorded: | 09/11/2018 | | |
| Attorney Dkt #: | 1420149.622US9 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/04/2020
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Application #:
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16072660
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Filing Dt:
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09/11/2018
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Publication #:
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Pub Dt:
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01/31/2019
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Title:
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Ag UNDERLAYER- ATTACHED METALLIC MEMBER, Ag UNDERLAYER- ATTACHED INSULATING CIRCUIT SUBSTRATE,SEMICONDUCTOR DEVICE, HEAT SINK- ATTACHED INSULATING CIRCUIT SUBSTRATE, AND METHOD FOR MANUFACTURING Ag UNDERLAYER-ATTACHED METALLIC MEMBER
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Assignee
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| 3-2, OTEMACHI 1-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-8117 |
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Correspondence name and address
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LOCKE LORD LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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