Patent Assignment Details
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Reel/Frame: | 014502/0955 | |
| Pages: | 3 |
| | Recorded: | 09/15/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10663207
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Filing Dt:
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09/15/2003
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Publication #:
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Pub Dt:
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03/17/2005
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Title:
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Thermal interface adhesive
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Assignee
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1-1 KAMIKODANAKA 4-CHOME NAKAHARA-KU, KAWASAKI-SHI |
KANAGAWA, JAPAN 211-8588 |
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Correspondence name and address
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SHEPPARD, MULLIN, RICHTER, ET AL.
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DAVID SCHNAPF
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333 S. HOPE STREET
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48TH FLOOR
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LOS ANGELES, CA 90071-1406
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