Patent Assignment Details
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| Reel/Frame: | 014756/0958 | |
| Pages: | 2 |
| | Recorded: | 12/01/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/12/2006
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Application #:
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10724133
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Filing Dt:
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12/01/2003
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Publication #:
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Pub Dt:
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01/20/2005
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Title:
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METHOD OF FORMING METAL LINE LAYER IN SEMICONDUCTOR DEVICE
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Assignee
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| SAN 136-1, AMI-RI, BUBAL-UEP |
| ICHON-SHI, KYUNGKI-DO, KOREA, REPUBLIC OF 467-860 |
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Correspondence name and address
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JACOBSON HOLMAN PLLC
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YOON S. HAM
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400 7TH STREET, N.W.
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WASHINGTON, D.C. 20004-2218
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