Patent Assignment Details
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Reel/Frame: | 017330/0959 | |
| Pages: | 3 |
| | Recorded: | 03/19/2006 | | |
Attorney Dkt #: | 27-156 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/21/2009
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Application #:
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11354694
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Filing Dt:
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02/14/2006
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Publication #:
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Pub Dt:
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05/17/2007
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Title:
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INTEGRATED CIRCUIT PACKAGE SYSTEM WITH HEAT DISSIPATION ENCLOSURE
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Assignee
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5 YISHUN STREET 23 |
SINGAPORE, SINGAPORE 768442 |
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Correspondence name and address
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THE LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL
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SUITE 330
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SUNNYVALE, CA 94087
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