Patent Assignment Details
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Reel/Frame: | 056963/0963 | |
| Pages: | 5 |
| | Recorded: | 07/23/2021 | | |
Attorney Dkt #: | 60616-0020 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17382131
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Filing Dt:
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07/21/2021
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Publication #:
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Pub Dt:
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03/17/2022
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Title:
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LASER MACHINING EQUIPMENT FOR GRINDING SEMICONDUCTOR WAFERS
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Assignees
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NO.37, XUEYUAN ROAD, HAIDIAN DISTRICT |
BEIJING, CHINA 100191 |
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QINGHUAYUAN, HAIDIAN DISTRICT |
BEIJING, CHINA 100084 |
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Correspondence name and address
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AGATHA H. LIU
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1 ALMADEN BOULEVARD, FLOOR 12
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SAN JOSE, CA 95113
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Search Results as of:
06/19/2024 04:51 PM
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