Total properties:
915
Page
9
of
10
Pages:
1 2 3 4 5 6 7 8 9 10
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2013
|
Application #:
|
13071329
|
Filing Dt:
|
03/24/2011
|
Publication #:
|
|
Pub Dt:
|
09/06/2012
| | | | |
Title:
|
IGBT POWER SEMICONDUCTOR PACKAGE HAVING A CONDUCTIVE CLIP
|
|
|
Patent #:
|
|
Issue Dt:
|
01/28/2014
|
Application #:
|
13075597
|
Filing Dt:
|
03/30/2011
|
Publication #:
|
|
Pub Dt:
|
10/04/2012
| | | | |
Title:
|
DUAL COMPARTMENT SEMICONDUCTOR PACKAGE WITH TEMPERATURE SENSOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/05/2012
|
Application #:
|
13081744
|
Filing Dt:
|
04/07/2011
|
Publication #:
|
|
Pub Dt:
|
07/28/2011
| | | | |
Title:
|
DRIVING CIRCUIT FOR DEPLETION MODE SEMICONDUCTOR SWITCHES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/2014
|
Application #:
|
13087188
|
Filing Dt:
|
04/14/2011
|
Publication #:
|
|
Pub Dt:
|
08/23/2012
| | | | |
Title:
|
POWER SUPPLY CIRCUITRY AND ADAPTIVE TRANSIENT CONTROL
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2013
|
Application #:
|
13088573
|
Filing Dt:
|
04/18/2011
|
Publication #:
|
|
Pub Dt:
|
10/18/2012
| | | | |
Title:
|
BONDWIRELESS POWER MODULE WITH THREE-DIMENSIONAL CURRENT ROUTING
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2015
|
Application #:
|
13094695
|
Filing Dt:
|
04/26/2011
|
Publication #:
|
|
Pub Dt:
|
11/01/2012
| | | | |
Title:
|
Power Module with Press-Fit Clamps
|
|
|
Patent #:
|
|
Issue Dt:
|
11/25/2014
|
Application #:
|
13095146
|
Filing Dt:
|
04/27/2011
|
Publication #:
|
|
Pub Dt:
|
07/05/2012
| | | | |
Title:
|
High Power Semiconductor Package with Conductive Clip
|
|
|
Patent #:
|
|
Issue Dt:
|
07/30/2013
|
Application #:
|
13095247
|
Filing Dt:
|
04/27/2011
|
Publication #:
|
|
Pub Dt:
|
07/05/2012
| | | | |
Title:
|
HIGH POWER SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP ON MULTIPLE TRANSISTORS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/30/2013
|
Application #:
|
13095650
|
Filing Dt:
|
04/27/2011
|
Publication #:
|
|
Pub Dt:
|
07/05/2012
| | | | |
Title:
|
HIGH POWER SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIPS AND FLIP CHIP DRIVER IC
|
|
|
Patent #:
|
|
Issue Dt:
|
06/10/2014
|
Application #:
|
13095725
|
Filing Dt:
|
04/27/2011
|
Publication #:
|
|
Pub Dt:
|
07/05/2012
| | | | |
Title:
|
HIGH POWER SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP AND FLIP CHIP DRIVER IC WITH INTEGRATED CONTROL TRANSISTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
08/14/2012
|
Application #:
|
13108259
|
Filing Dt:
|
05/16/2011
|
Publication #:
|
|
Pub Dt:
|
09/08/2011
| | | | |
Title:
|
HEMT/GAN HALF-BRIDGE CIRCUIT
|
|
|
Patent #:
|
|
Issue Dt:
|
12/16/2014
|
Application #:
|
13111638
|
Filing Dt:
|
05/19/2011
|
Publication #:
|
|
Pub Dt:
|
07/26/2012
| | | | |
Title:
|
SYNCHRONOUS BUCK CONVERTER INCLUDING MULTI-MODE CONTROL FOR LIGHT LOAD EFFICIENCY AND RELATED METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2013
|
Application #:
|
13111712
|
Filing Dt:
|
05/19/2011
|
Publication #:
|
|
Pub Dt:
|
11/22/2012
| | | | |
Title:
|
MULTI-TRANSISTOR EXPOSED CONDUCTIVE CLIP FOR HIGH POWER SEMICONDUCTOR PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2013
|
Application #:
|
13111812
|
Filing Dt:
|
05/19/2011
|
Publication #:
|
|
Pub Dt:
|
11/22/2012
| | | | |
Title:
|
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH EXPOSED PARALLEL CONDUCTIVE CLIP
|
|
|
Patent #:
|
|
Issue Dt:
|
12/24/2013
|
Application #:
|
13111904
|
Filing Dt:
|
05/19/2011
|
Publication #:
|
|
Pub Dt:
|
11/22/2012
| | | | |
Title:
|
Common Drain Exposed Conductive Clip for High Power Semiconductor Packages
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2014
|
Application #:
|
13115337
|
Filing Dt:
|
05/25/2011
|
Publication #:
|
|
Pub Dt:
|
09/15/2011
| | | | |
Title:
|
METHOD FOR FABRICATION OF III-NITRIDE HETEROJUNCTION SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2014
|
Application #:
|
13117450
|
Filing Dt:
|
05/27/2011
|
Publication #:
|
|
Pub Dt:
|
09/22/2011
| | | | |
Title:
|
III-NITRIDE SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/11/2012
|
Application #:
|
13154095
|
Filing Dt:
|
06/06/2011
|
Publication #:
|
|
Pub Dt:
|
09/29/2011
| | | | |
Title:
|
POWER SUPPLY CIRCUIT AND DYNAMIC SWITCH VOLTAGE CONTROL
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
13154360
|
Filing Dt:
|
06/06/2011
|
Publication #:
|
|
Pub Dt:
|
12/06/2012
| | | | |
Title:
|
SEMICONDUCTOR WAFER WITH REDUCED THICKNESS VARIATION AND METHOD FOR FABRICATING SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/2014
|
Application #:
|
13155804
|
Filing Dt:
|
06/08/2011
|
Publication #:
|
|
Pub Dt:
|
12/13/2012
| | | | |
Title:
|
POWER SEMICONDUCTOR PACKAGE WITH DOUBLE-SIDED COOLING
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2013
|
Application #:
|
13157562
|
Filing Dt:
|
06/10/2011
|
Publication #:
|
|
Pub Dt:
|
12/13/2012
| | | | |
Title:
|
ENHANCEMENT MODE GROUP III-V HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) AND METHOD FOR FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/02/2013
|
Application #:
|
13173364
|
Filing Dt:
|
06/30/2011
|
Title:
|
SWITCHING POWER SUPPLY GATE DRIVER
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
13188002
|
Filing Dt:
|
07/21/2011
|
Publication #:
|
|
Pub Dt:
|
01/17/2013
| | | | |
Title:
|
Stacked Half-Bridge Power Module
|
|
|
Patent #:
|
|
Issue Dt:
|
07/29/2014
|
Application #:
|
13188251
|
Filing Dt:
|
07/21/2011
|
Publication #:
|
|
Pub Dt:
|
11/10/2011
| | | | |
Title:
|
INTERDIGITATED CONDUCTIVE SUPPORT FOR GAN SEMICONDUCTOR DIE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/01/2013
|
Application #:
|
13188299
|
Filing Dt:
|
07/21/2011
|
Publication #:
|
|
Pub Dt:
|
11/10/2011
| | | | |
Title:
|
ENHANCEMENT MODE III-NITRIDE FET
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2013
|
Application #:
|
13192737
|
Filing Dt:
|
07/28/2011
|
Publication #:
|
|
Pub Dt:
|
11/17/2011
| | | | |
Title:
|
DIRECT CONTACT LEADLESS PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/27/2012
|
Application #:
|
13193449
|
Filing Dt:
|
07/28/2011
|
Publication #:
|
|
Pub Dt:
|
11/17/2011
| | | | |
Title:
|
LEADLESS PACKAGE FOR HIGH CURRENT DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/14/2015
|
Application #:
|
13194073
|
Filing Dt:
|
07/29/2011
|
Publication #:
|
|
Pub Dt:
|
01/31/2013
| | | | |
Title:
|
ENERGY STORAGE SYSTEM AND RELATED METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
05/06/2014
|
Application #:
|
13219297
|
Filing Dt:
|
08/26/2011
|
Publication #:
|
|
Pub Dt:
|
02/28/2013
| | | | |
Title:
|
Power Saving Resonant Gate Driver and Related Method
|
|
|
Patent #:
|
|
Issue Dt:
|
02/05/2013
|
Application #:
|
13224881
|
Filing Dt:
|
09/02/2011
|
Publication #:
|
|
Pub Dt:
|
02/23/2012
| | | | |
Title:
|
HYBRID SEMICONDUCTOR DEVICE HAVING A GAN TRANSISTOR AND A SILICON MOSFET
|
|
|
Patent #:
|
|
Issue Dt:
|
10/28/2014
|
Application #:
|
13247632
|
Filing Dt:
|
09/28/2011
|
Publication #:
|
|
Pub Dt:
|
03/28/2013
| | | | |
Title:
|
SYSTEM FOR ACTIVELY MANAGING ENERGY BANKS DURING ENERGY TRANSFER AND RELATED METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
07/07/2015
|
Application #:
|
13288500
|
Filing Dt:
|
11/03/2011
|
Publication #:
|
|
Pub Dt:
|
09/20/2012
| | | | |
Title:
|
HIGH VOLTAGE RECTIFIER AND SWITCHING CIRCUITS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2015
|
Application #:
|
13298694
|
Filing Dt:
|
11/17/2011
|
Publication #:
|
|
Pub Dt:
|
03/15/2012
| | | | |
Title:
|
POWER CONVERTER WITH SPLIT POWER SUPPLY
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2013
|
Application #:
|
13299785
|
Filing Dt:
|
11/18/2011
|
Publication #:
|
|
Pub Dt:
|
03/15/2012
| | | | |
Title:
|
III-Nitride Power Converter Circuit
|
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2013
|
Application #:
|
13303075
|
Filing Dt:
|
11/22/2011
|
Publication #:
|
|
Pub Dt:
|
03/22/2012
| | | | |
Title:
|
METHOD FOR FORMING GALLIUM NITRIDE DEVICES WITH CONDUCTIVE REGIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2013
|
Application #:
|
13303109
|
Filing Dt:
|
11/22/2011
|
Publication #:
|
|
Pub Dt:
|
03/22/2012
| | | | |
Title:
|
GALLIUM NITRIDE DEVICES WITH ELECTRICALLY CONDUCTIVE REGIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2014
|
Application #:
|
13308052
|
Filing Dt:
|
11/30/2011
|
Title:
|
PACKAGING OF ELECTRONIC CIRCUITRY
|
|
|
Patent #:
|
|
Issue Dt:
|
08/19/2014
|
Application #:
|
13308068
|
Filing Dt:
|
11/30/2011
|
Title:
|
PACKAGING OF ELECTRONIC CIRCUITRY
|
|
|
Patent #:
|
|
Issue Dt:
|
04/14/2015
|
Application #:
|
13309378
|
Filing Dt:
|
12/01/2011
|
Publication #:
|
|
Pub Dt:
|
06/07/2012
| | | | |
Title:
|
PARAMETER ADJUSTMENT DEPENDING ON RESONANT FREQUENCY OF A POWER SUPPLY
|
|
|
Patent #:
|
|
Issue Dt:
|
01/12/2016
|
Application #:
|
13334720
|
Filing Dt:
|
12/22/2011
|
Publication #:
|
|
Pub Dt:
|
04/19/2012
| | | | |
Title:
|
PROGRAMMABLE GATE III-NITRIDE POWER TRANSISTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
05/19/2015
|
Application #:
|
13338013
|
Filing Dt:
|
12/27/2011
|
Title:
|
POWER SUPPLY CIRCUITRY AND CURRENT MEASUREMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2013
|
Application #:
|
13345395
|
Filing Dt:
|
01/06/2012
|
Publication #:
|
|
Pub Dt:
|
05/03/2012
| | | | |
Title:
|
DIRECT CONTACT FLIP CHIP PACKAGE WITH POWER TRANSISTORS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2013
|
Application #:
|
13345467
|
Filing Dt:
|
01/06/2012
|
Publication #:
|
|
Pub Dt:
|
05/03/2012
| | | | |
Title:
|
DIRECT CONTACT SEMICONDUCTOR PACKAGE WITH POWER TRANSISTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
10/07/2014
|
Application #:
|
13364189
|
Filing Dt:
|
02/01/2012
|
Publication #:
|
|
Pub Dt:
|
11/08/2012
| | | | |
Title:
|
HIGH VOLTAGE CASCODED III-NITRIDE RECTIFIER PACKAGE WITH STAMPED LEADFRAME
|
|
|
Patent #:
|
|
Issue Dt:
|
10/07/2014
|
Application #:
|
13364219
|
Filing Dt:
|
02/01/2012
|
Publication #:
|
|
Pub Dt:
|
11/08/2012
| | | | |
Title:
|
High Voltage Cascoded III-Nitride Rectifier Package with Etched Leadframe
|
|
|
Patent #:
|
|
Issue Dt:
|
10/01/2013
|
Application #:
|
13364242
|
Filing Dt:
|
02/01/2012
|
Publication #:
|
|
Pub Dt:
|
11/08/2012
| | | | |
Title:
|
HIGH VOLTAGE CASCODED III-NITRIDE RECTIFIER PACKAGE UTILIZING CLIPS ON PACKAGE SUPPORT SURFACE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/09/2014
|
Application #:
|
13396495
|
Filing Dt:
|
02/14/2012
|
Publication #:
|
|
Pub Dt:
|
05/16/2013
| | | | |
Title:
|
POWER SUPPLY CIRCUITRY AND ADAPTIVE TRANSIENT CONTROL
|
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2014
|
Application #:
|
13397190
|
Filing Dt:
|
02/15/2012
|
Publication #:
|
|
Pub Dt:
|
08/30/2012
| | | | |
Title:
|
III-NITRIDE HETEROJUNCTION DEVICES HAVING A MULTILAYER SPACER
|
|
|
Patent #:
|
|
Issue Dt:
|
02/17/2015
|
Application #:
|
13405180
|
Filing Dt:
|
02/24/2012
|
Publication #:
|
|
Pub Dt:
|
09/06/2012
| | | | |
Title:
|
III-NITRIDE SEMICONDUCTOR STRUCTURES WITH STRAIN ABSORBING INTERLAYER TRANSITION MODULES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/01/2014
|
Application #:
|
13417143
|
Filing Dt:
|
03/09/2012
|
Publication #:
|
|
Pub Dt:
|
09/12/2013
| | | | |
Title:
|
Composite Semiconductor Device with Active Oscillation Prevention
|
|
|
Patent #:
|
|
Issue Dt:
|
07/02/2013
|
Application #:
|
13431888
|
Filing Dt:
|
03/27/2012
|
Publication #:
|
|
Pub Dt:
|
11/22/2012
| | | | |
Title:
|
Monolithic Group III-V Power Converter
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
13433864
|
Filing Dt:
|
03/29/2012
|
Publication #:
|
|
Pub Dt:
|
10/11/2012
| | | | |
Title:
|
Stacked Composite Device Including a Group III-V Transistor and a Group IV Lateral Transistor
|
|
|
Patent #:
|
|
Issue Dt:
|
07/07/2015
|
Application #:
|
13438707
|
Filing Dt:
|
04/03/2012
|
Title:
|
PACKAGING OF ELECTRONIC CIRCUITRY
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2014
|
Application #:
|
13455023
|
Filing Dt:
|
04/24/2012
|
Title:
|
P TYPE III-NITRIDE MATERIALS AND FORMATION THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2013
|
Application #:
|
13472258
|
Filing Dt:
|
05/15/2012
|
Publication #:
|
|
Pub Dt:
|
09/06/2012
| | | | |
Title:
|
Programmable Gate III-Nitride Semiconductor Device
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
13542194
|
Filing Dt:
|
07/05/2012
|
Publication #:
|
|
Pub Dt:
|
01/17/2013
| | | | |
Title:
|
Nested Composite Switch
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2016
|
Application #:
|
13544829
|
Filing Dt:
|
07/09/2012
|
Publication #:
|
|
Pub Dt:
|
01/17/2013
| | | | |
Title:
|
Composite Semiconductor Device with a SOI Substrate Having an Integrated Diode
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2013
|
Application #:
|
13609746
|
Filing Dt:
|
09/11/2012
|
Publication #:
|
|
Pub Dt:
|
01/03/2013
| | | | |
Title:
|
GATED ALGAN/GAN SCHOTTKY DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2015
|
Application #:
|
13656341
|
Filing Dt:
|
10/19/2012
|
Publication #:
|
|
Pub Dt:
|
10/03/2013
| | | | |
Title:
|
MONOLITHIC POWER CONVERTER PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2014
|
Application #:
|
13656461
|
Filing Dt:
|
10/19/2012
|
Publication #:
|
|
Pub Dt:
|
10/03/2013
| | | | |
Title:
|
Monolithic Power Converter Package with Through Substrate Vias
|
|
|
Patent #:
|
|
Issue Dt:
|
05/27/2014
|
Application #:
|
13660399
|
Filing Dt:
|
10/25/2012
|
Publication #:
|
|
Pub Dt:
|
05/09/2013
| | | | |
Title:
|
METHOD FOR FABRICATING A VERTICAL LDMOS DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2014
|
Application #:
|
13666854
|
Filing Dt:
|
11/01/2012
|
Publication #:
|
|
Pub Dt:
|
05/01/2014
| | | | |
Title:
|
Buck Converter Power Package
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2016
|
Application #:
|
13715984
|
Filing Dt:
|
12/14/2012
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
ELECTRONIC BALLAST WITH POWER FACTOR CORRECTION
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2016
|
Application #:
|
13727899
|
Filing Dt:
|
12/27/2012
|
Publication #:
|
|
Pub Dt:
|
05/30/2013
| | | | |
Title:
|
MULTI-TRANSISTOR EXPOSED CONDUCTIVE CLIP FOR SEMICONDUCTOR PACKAGES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2014
|
Application #:
|
13729394
|
Filing Dt:
|
12/28/2012
|
Publication #:
|
|
Pub Dt:
|
05/30/2013
| | | | |
Title:
|
GALLIUM NITRIDE DEVICES WITH CONDUCTIVE REGIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/27/2014
|
Application #:
|
13734223
|
Filing Dt:
|
01/04/2013
|
Publication #:
|
|
Pub Dt:
|
05/16/2013
| | | | |
Title:
|
Power Module with Current Routing
|
|
|
Patent #:
|
|
Issue Dt:
|
03/25/2014
|
Application #:
|
13734802
|
Filing Dt:
|
01/04/2013
|
Publication #:
|
|
Pub Dt:
|
05/23/2013
| | | | |
Title:
|
Gallium Nitride Devices with Vias
|
|
|
Patent #:
|
|
Issue Dt:
|
08/25/2015
|
Application #:
|
13739422
|
Filing Dt:
|
01/11/2013
|
Publication #:
|
|
Pub Dt:
|
06/06/2013
| | | | |
Title:
|
POWER SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2015
|
Application #:
|
13750986
|
Filing Dt:
|
01/25/2013
|
Publication #:
|
|
Pub Dt:
|
08/22/2013
| | | | |
Title:
|
Power Transistor Having Segmented Gate
|
|
|
Patent #:
|
|
Issue Dt:
|
10/27/2015
|
Application #:
|
13759831
|
Filing Dt:
|
02/05/2013
|
Publication #:
|
|
Pub Dt:
|
10/03/2013
| | | | |
Title:
|
Dual Power Converter Package Using External Driver IC
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2015
|
Application #:
|
13780055
|
Filing Dt:
|
02/28/2013
|
Title:
|
PACKAGING OF ELECTRONIC CIRCUITRY
|
|
|
Patent #:
|
|
Issue Dt:
|
04/08/2014
|
Application #:
|
13788318
|
Filing Dt:
|
03/07/2013
|
Publication #:
|
|
Pub Dt:
|
08/01/2013
| | | | |
Title:
|
METHOD AND APPARATUS FOR GROWING A III-NITRIDE LAYER
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2016
|
Application #:
|
13791589
|
Filing Dt:
|
03/08/2013
|
Publication #:
|
|
Pub Dt:
|
10/03/2013
| | | | |
Title:
|
IGBT with Buried Emitter Electrode
|
|
|
Patent #:
|
|
Issue Dt:
|
10/07/2014
|
Application #:
|
13804395
|
Filing Dt:
|
03/14/2013
|
Publication #:
|
|
Pub Dt:
|
08/15/2013
| | | | |
Title:
|
POWER DEVICE WITH SOLDERABLE FRONT METAL
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2014
|
Application #:
|
13891080
|
Filing Dt:
|
05/09/2013
|
Publication #:
|
|
Pub Dt:
|
09/19/2013
| | | | |
Title:
|
III-NITRIDE MULTI-CHANNEL HETEROJUNCTION DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/25/2014
|
Application #:
|
13895694
|
Filing Dt:
|
05/16/2013
|
Publication #:
|
|
Pub Dt:
|
09/26/2013
| | | | |
Title:
|
DIRECT CONTACT PACKAGE FOR POWER TRANSISTORS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/20/2014
|
Application #:
|
13906098
|
Filing Dt:
|
05/30/2013
|
Publication #:
|
|
Pub Dt:
|
10/03/2013
| | | | |
Title:
|
PROGRAMMABLE III-NITRIDE SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2014
|
Application #:
|
13906280
|
Filing Dt:
|
05/30/2013
|
Publication #:
|
|
Pub Dt:
|
10/10/2013
| | | | |
Title:
|
III-Nitride Heterojunction Device
|
|
|
Patent #:
|
|
Issue Dt:
|
04/07/2015
|
Application #:
|
13906294
|
Filing Dt:
|
05/30/2013
|
Publication #:
|
|
Pub Dt:
|
10/03/2013
| | | | |
Title:
|
III-Nitride Heterojunction Device
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
13934499
|
Filing Dt:
|
07/03/2013
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
Title:
|
Level Shifter Having Feedback Signal From High Voltage Circuit
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2014
|
Application #:
|
13934546
|
Filing Dt:
|
07/03/2013
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
Title:
|
LEVEL SHIFTER UTILIZING BIDIRECTIONAL SIGNALING THROUGH A CAPACITIVE ISOLATION BARRIER
|
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2015
|
Application #:
|
13934579
|
Filing Dt:
|
07/03/2013
|
Publication #:
|
|
Pub Dt:
|
01/23/2014
| | | | |
Title:
|
MODULAR POWER CONVERTER HAVING REDUCED SWITCHING LOSS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/21/2014
|
Application #:
|
13956620
|
Filing Dt:
|
08/01/2013
|
Publication #:
|
|
Pub Dt:
|
11/28/2013
| | | | |
Title:
|
MULTI-CHIP-SCALE PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/24/2015
|
Application #:
|
13969546
|
Filing Dt:
|
08/17/2013
|
Publication #:
|
|
Pub Dt:
|
12/19/2013
| | | | |
Title:
|
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH CONDUCTIVE CLIP
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2015
|
Application #:
|
14018238
|
Filing Dt:
|
09/04/2013
|
Publication #:
|
|
Pub Dt:
|
04/17/2014
| | | | |
Title:
|
Surface Mountable Power Components
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2015
|
Application #:
|
14019962
|
Filing Dt:
|
09/06/2013
|
Publication #:
|
|
Pub Dt:
|
01/02/2014
| | | | |
Title:
|
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
08/18/2015
|
Application #:
|
14022584
|
Filing Dt:
|
09/10/2013
|
Publication #:
|
|
Pub Dt:
|
04/24/2014
| | | | |
Title:
|
Semiconductor Package with Conductive Carrier Integrated Heat Spreader
|
|
|
Patent #:
|
|
Issue Dt:
|
07/29/2014
|
Application #:
|
14038384
|
Filing Dt:
|
09/26/2013
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
Title:
|
HIGH VOLTAGE CASCODED III-NITRIDE RECTIFIER PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/27/2015
|
Application #:
|
14045949
|
Filing Dt:
|
10/04/2013
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
Title:
|
ELECTRICAL CONNECTIVITY FOR CIRCUIT APPLICATIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/2014
|
Application #:
|
14049138
|
Filing Dt:
|
10/08/2013
|
Publication #:
|
|
Pub Dt:
|
02/06/2014
| | | | |
Title:
|
III-NITRIDE WAFER FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2015
|
Application #:
|
14073783
|
Filing Dt:
|
11/06/2013
|
Publication #:
|
|
Pub Dt:
|
06/19/2014
| | | | |
Title:
|
CASCODE CIRCUIT INTEGRATION OF GROUP III-N AND GROUP IV DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2015
|
Application #:
|
14082007
|
Filing Dt:
|
11/15/2013
|
Publication #:
|
|
Pub Dt:
|
03/13/2014
| | | | |
Title:
|
ACTIVE AREA SHAPING OF III-NITRIDE DEVICES UTILIZING STEPS OF SOURCE-SIDE AND DRAIN-SIDE FIELD PLATES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/21/2014
|
Application #:
|
14135425
|
Filing Dt:
|
12/19/2013
|
Publication #:
|
|
Pub Dt:
|
04/17/2014
| | | | |
Title:
|
FABRICATION OF III-NITRIDE SEMICONDUCTOR DEVICE AND RELATED STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/14/2014
|
Application #:
|
14162508
|
Filing Dt:
|
01/23/2014
|
Publication #:
|
|
Pub Dt:
|
05/15/2014
| | | | |
Title:
|
SEMICONDUCTOR PACKAGE WITH TEMPERATURE SENSOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2015
|
Application #:
|
14162690
|
Filing Dt:
|
01/23/2014
|
Publication #:
|
|
Pub Dt:
|
05/15/2014
| | | | |
Title:
|
DUAL COMPARTMENT SEMICONDUCTOR PACKAGE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2015
|
Application #:
|
14168926
|
Filing Dt:
|
01/30/2014
|
Publication #:
|
|
Pub Dt:
|
08/14/2014
| | | | |
Title:
|
Integrated Half-Bridge Circuit with Low Side and High Side Composite Switches
|
|
|
Patent #:
|
|
Issue Dt:
|
12/22/2015
|
Application #:
|
14170293
|
Filing Dt:
|
01/31/2014
|
Publication #:
|
|
Pub Dt:
|
05/29/2014
| | | | |
Title:
|
Ion Implantation at High Temperature Surface Equilibrium Conditions
|
|
|
Patent #:
|
|
Issue Dt:
|
06/30/2015
|
Application #:
|
14175378
|
Filing Dt:
|
02/07/2014
|
Publication #:
|
|
Pub Dt:
|
08/07/2014
| | | | |
Title:
|
ELECTRICAL CONNECTIVITY OF DIE TO A HOST SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/24/2015
|
Application #:
|
14191910
|
Filing Dt:
|
02/27/2014
|
Publication #:
|
|
Pub Dt:
|
09/11/2014
| | | | |
Title:
|
DELAMINATION AND CRACK PREVENTION IN III-NITRIDE WAFERS
|
|
|
Patent #:
|
|
Issue Dt:
|
10/27/2015
|
Application #:
|
14197358
|
Filing Dt:
|
03/05/2014
|
Publication #:
|
|
Pub Dt:
|
09/11/2014
| | | | |
Title:
|
DRIVE ENHANCEMENT IN SWITCH DRIVER CIRCUITRY
|
|