Patent Assignment Details
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Reel/Frame: | 022537/0970 | |
| Pages: | 2 |
| | Recorded: | 04/13/2009 | | |
Attorney Dkt #: | 4459-300 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12422477
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Filing Dt:
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04/13/2009
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Publication #:
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Pub Dt:
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10/22/2009
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Title:
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MODULE FOR PACKAGING ELECTRONIC COMPONENTS BY USING A CAP
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Assignee
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NO. 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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Correspondence name and address
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LOWE HAUPTMAN HAM & BERNER, LLP
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1700 DIAGONAL ROAD
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SUITE 300
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ALEXANDRIA, VA 22314
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