Patent Assignment Details
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| Reel/Frame: | 023880/0970 | |
| Pages: | 3 |
| | Recorded: | 02/02/2010 | | |
| Attorney Dkt #: | 29440-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/20/2013
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Application #:
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12691722
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Filing Dt:
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01/21/2010
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Publication #:
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Pub Dt:
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07/29/2010
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Title:
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PACKAGE SUBSTRATE STRUCTURE AND CHIP PACKAGE STRUCTURE AND MANUFACTURING PROCESS THEREOF
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Assignee
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| NO.25, LANE 76, SEC.3, CHUNG YANG ROAD. |
| TUCHENG |
| TAIPEI, TAIWAN |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE
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7F-1, NO.100, ROOSEVELT RD., SEC.2
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TAIPEI, 100 TAIWAN
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