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Reel/Frame:029929/0971   Pages: 2
Recorded: 03/05/2013
Attorney Dkt #:SUP-022-2P6P1D1P
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
04/07/2015
Application #:
13786412
Filing Dt:
03/05/2013
Publication #:
Pub Dt:
07/18/2013
Title:
Molding Method For COB-EUSB Devices And Metal Housing Package
Assignors
1
Exec Dt:
03/04/2013
2
Exec Dt:
03/04/2013
3
Exec Dt:
03/04/2013
Assignee
1
2077 NORTH CAPITOL AVENUE
SAN JOSE, CALIFORNIA 95132
Correspondence name and address
BEVER HOFFMAN & HARMS, LLP
901 CAMPISI WAY, SUITE 370
CAMPBELL, CA 95008

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