Patent Assignment Details
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Reel/Frame: | 031993/0975 | |
| Pages: | 4 |
| | Recorded: | 01/17/2014 | | |
Attorney Dkt #: | 200802623 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/11/2014
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Application #:
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13176118
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Filing Dt:
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07/05/2011
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Publication #:
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Pub Dt:
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10/27/2011
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Title:
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RESIN MOLDED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
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Assignees
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5-5, KEIHAN-HONDORI 2-CHOME; MORIGUCHI-SHI |
MORIGUCHI-SHI, OSAKA, JAPAN 570-8677 |
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1-1-1, SAKATA, OIZUMI-MACHI, ORA-GUN |
GUNMA, JAPAN 370-0596 |
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Correspondence name and address
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SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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5005 EAST MCDOWELL ROAD
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A700
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PHOENIX, AZ 85008
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