Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 054944/0975 | |
| Pages: | 2 |
| | Recorded: | 01/18/2021 | | |
| Attorney Dkt #: | 82148132US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/28/2023
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Application #:
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17151356
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Filing Dt:
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01/18/2021
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Publication #:
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Pub Dt:
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06/03/2021
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Title:
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SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICROELECTRONIC DEVICES CONTAINING THE SAME, AND ASSOCIATED FABRICATION METHODS
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Assignee
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| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TEXAS 78735 |
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Correspondence name and address
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NXP USA, INC. LAW DEPARTMENT
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6501 WILLIAM CANNON DRIVE WEST TX30/OE62
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AUSTIN, TX 78735
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