Patent Assignment Details
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Reel/Frame: | 032439/0976 | |
| Pages: | 14 |
| | Recorded: | 03/14/2014 | | |
Attorney Dkt #: | 112174-8002.US00 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/20/2016
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Application #:
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14174736
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Filing Dt:
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02/06/2014
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Publication #:
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Pub Dt:
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06/05/2014
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Title:
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PLATING EQUIPMENT FOR SOLAR CELL WAFER USING ELECTROPLATING AND LIGHT-INDUCED PLATING JOINTLY AND METHOD OF THE SAME
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Assignee
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15 BLOCK 1LOT, BANWOL INDUSTRIAL COMPLEX |
MONKNAE-RO 119-91, DANWON-GU, GYEONGGI-DO |
ANSAN-SI, KOREA, REPUBLIC OF 425-100 |
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Correspondence name and address
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BING AI
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PERKINS COIE LLP
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PO BOX 1247
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SEATTLE, WA 98111-1247
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