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Reel/Frame:032439/0976   Pages: 14
Recorded: 03/14/2014
Attorney Dkt #:112174-8002.US00
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/20/2016
Application #:
14174736
Filing Dt:
02/06/2014
Publication #:
Pub Dt:
06/05/2014
Title:
PLATING EQUIPMENT FOR SOLAR CELL WAFER USING ELECTROPLATING AND LIGHT-INDUCED PLATING JOINTLY AND METHOD OF THE SAME
Assignors
1
Exec Dt:
03/10/2014
2
Exec Dt:
03/10/2014
3
Exec Dt:
03/10/2014
Assignee
1
15 BLOCK 1LOT, BANWOL INDUSTRIAL COMPLEX
MONKNAE-RO 119-91, DANWON-GU, GYEONGGI-DO
ANSAN-SI, KOREA, REPUBLIC OF 425-100
Correspondence name and address
BING AI
PERKINS COIE LLP
PO BOX 1247
SEATTLE, WA 98111-1247

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