Patent Assignment Details
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Reel/Frame: | 009620/0977 | |
| Pages: | 3 |
| | Recorded: | 12/04/1998 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/31/2002
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Application #:
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09140533
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Filing Dt:
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08/26/1998
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Title:
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HEAT RESISTANT, LOW DIELECTRIC POLYMERS, AND FILMS, SUBSTRATES, ELECTRONIC PARTS AND HEAT RESISTANT RESIN MOLDED PARTS USING THE SAME
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Assignees
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13-1, NIHONBASHI 1-CHOME |
CHUO-KU, TOKYO, JAPAN |
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20-3, EBISU 4-CHOME, SHIBUYA-KU |
TOKYO, JAPAN |
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Correspondence name and address
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OBLON, SPIVAK, MCCLELLAND, MAIER ET AL
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NORMAN F. OBLON
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ATTORNEYS AT LAW, FOURTH FLOOR
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1755 JEFFERSON DAVIS HIGHWAY
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ARLINGTON, VA 22202
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