Patent Assignment Details
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Reel/Frame: | 060672/0978 | |
| Pages: | 8 |
| | Recorded: | 07/29/2022 | | |
Attorney Dkt #: | CK-003-1C |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/21/2024
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Application #:
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17720211
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Filing Dt:
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04/13/2022
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Publication #:
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Pub Dt:
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07/28/2022
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Title:
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DEVICE CHIP SCALE PACKAGE INCLUDING A PROTECTIVE LAYER
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Assignee
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100, AMKOR-RO, BUK-GU |
GWANGJU, KOREA, REPUBLIC OF 61006 |
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Correspondence name and address
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SPECTRUM IP LAW GROUP LLC
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558 E CASTLE PINES PKWY, STE B4-362
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B4-362
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CASTLE PINES, CO 80108-4608
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06/18/2024 01:32 PM
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