Patent Assignment Details
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Reel/Frame: | 029986/0979 | |
| Pages: | 2 |
| | Recorded: | 03/13/2013 | | |
Attorney Dkt #: | T5057-Y372UA |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/17/2015
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Application #:
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13800626
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Filing Dt:
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03/13/2013
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Publication #:
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Pub Dt:
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08/01/2013
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Title:
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METHOD OF TESTING THROUGH SILICON VIAS (TSVS) OF THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC)
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Assignee
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NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300 |
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Correspondence name and address
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LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
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2318 MILL ROAD
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SUITE 1400
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ALEXANDRIA, VA 22314
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