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Reel/Frame:044740/0979   Pages: 5
Recorded: 01/26/2018
Attorney Dkt #:536-009.075
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/10/2020
Application #:
15718480
Filing Dt:
09/28/2017
Publication #:
Pub Dt:
10/04/2018
Title:
TECHNOLOGICAL METHOD FOR PREVENTING, BY MEANS OF BURIED ETCH STOP LAYERS, THE CREATION OF VERTICAL/LATERAL INHOMOGENEITIES WHEN ETCHING THROUGH-SILICON VIAS
Assignors
1
Exec Dt:
01/15/2018
2
Exec Dt:
01/19/2018
3
Exec Dt:
01/15/2018
4
Exec Dt:
01/15/2018
5
Exec Dt:
01/15/2018
6
Exec Dt:
01/15/2018
Assignee
1
IM TECHNOLOGIEPARK 25
FRANKFURT (ODER), GERMANY 15236
Correspondence name and address
WARE, FRESSOLA, MAGUIRE & BARBER LLP
BRADFORD GREEN, BUILDING 5
755 MAIN STREET
MONROE, CT 06468

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