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Patent Assignment Details
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Reel/Frame:062843/0979   Pages: 3
Recorded: 03/01/2023
Attorney Dkt #:KUZUP011US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18007218
Filing Dt:
01/27/2023
Publication #:
Pub Dt:
09/28/2023
Title:
IMPLANT USING NANOCOMPOSITE HYDROGEL
Assignor
1
Exec Dt:
02/18/2023
Assignees
1
3-1-14, HIGASHIKOIWA
EDOGAWA-KU
TOKYO, JAPAN 1330052
2
3-8, WAKAMATSUCHO
KOFU-SHI
YAMANASHI, JAPAN 4000866
Correspondence name and address
BRIAN S. BOYER
6655 LAKESHORE RD.
LEXINGTON, MI 48450

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