Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 014207/0980 | |
| Pages: | 2 |
| | Recorded: | 06/24/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/26/2003
|
Application #:
|
09699847
|
Filing Dt:
|
10/30/2000
|
|
Title:
|
STACKED MULTI-CHIP PACKAGE STRUCTURE WITH ON-CHIP INTEGRATION OF PASSIVE COMPONENT
|
|
|
Assignee
|
|
|
|
|
| NO. 123, SEC. 3, DA FONG ROAD |
| TANTZU, TAICHUNG, TAIWAN R.O.C. |
|
|
Correspondence name and address
|
| |
EDWARDS & ANGELL, LLP
|
| |
PETER F. CORLESS
|
| |
P.O. BOX 9169
|
| |
BOSTON, MASSACHUSETTS 02209
|
Search Results as of:
06/19/2024 09:00 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
