Patent Assignment Details
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| Reel/Frame: | 030774/0980 | |
| Pages: | 4 |
| | Recorded: | 07/11/2013 | | |
| Attorney Dkt #: | 092978C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/16/2008
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Application #:
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10962964
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Filing Dt:
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10/12/2004
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Publication #:
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Pub Dt:
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03/31/2005
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Title:
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RELIABLE METAL BUMPS ON TOP OF I/O PADS AFTER REMOVAL OF TEST PROBE MARKS
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Assignee
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| 21, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN ROC |
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Correspondence name and address
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QUALCOMM INCORPORATED
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5775 MOREHOUSE DRIVE
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SAN DIEGO, CA 92121-1714
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