Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 015127/0981 | |
| Pages: | 3 |
| | Recorded: | 03/25/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
5
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Patent #:
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Issue Dt:
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09/09/1997
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Application #:
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08606798
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Filing Dt:
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02/26/1996
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Title:
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LOW-TEMPERATURE FIRED CERAMIC CIRCUIT SUBSTRATE AND THICK-FILM PASTE FOR USE IN FABRICATION THEREOF
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Patent #:
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Issue Dt:
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03/09/1999
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Application #:
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08816032
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Filing Dt:
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03/11/1997
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Title:
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LOW-TEMPERATURE FIRED CERAMIC CIRCUIT SUBSTRATE AND THICK-FILM PASTE FOR USE IN FABRICATION THEREOF
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Patent #:
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Issue Dt:
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08/15/2000
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Application #:
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08934674
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Filing Dt:
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09/22/1997
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Title:
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CERAMIC CIRCUIT SUBSTRATE AND METHOD OF FABRICATING THE SAME
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Patent #:
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Issue Dt:
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09/26/2000
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Application #:
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09017949
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Filing Dt:
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02/03/1998
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Title:
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THICK-FILM RESISTOR PASTE
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Patent #:
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Issue Dt:
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04/08/2003
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Application #:
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09697150
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Filing Dt:
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10/27/2000
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Title:
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THICK-FILM RESISTOR AND CERAMIC CIRCUIT BOARD
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Assignee
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| 26-10, TENJIN 2-CHOME |
| NAGAOKAKYO-SHI |
| KYOTO 617-8555, JAPAN |
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Correspondence name and address
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FOLEY & LARDNER LLP
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RICHARD L. SCHWAAB
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3000 K STREET, N.W., SUITE 500
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WASHINGTON HARBOUR
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WASHINGTON, D.C. 20007-5143
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