Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 019301/0981 | |
| Pages: | 2 |
| | Recorded: | 05/16/2007 | | |
| Attorney Dkt #: | 4459-231 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/2009
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Application #:
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11749441
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Filing Dt:
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05/16/2007
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Publication #:
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Pub Dt:
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09/18/2008
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Title:
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MULTI-CHIP PACKAGE WITH A SINGLE DIE PAD
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Assignee
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| 26, CHIN 3RD RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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Correspondence name and address
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LOWE HAUPTMAN AND BERNER
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1700 DIAGONAL ROAD
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SUITE 300
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ALEXANDRIA, VA 22314
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