Patent Assignment Details
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Reel/Frame: | 024830/0981 | |
| Pages: | 4 |
| | Recorded: | 08/12/2010 | | |
Attorney Dkt #: | 1248/226A |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/28/2014
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Application #:
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12855447
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Filing Dt:
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08/12/2010
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Publication #:
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Pub Dt:
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06/02/2011
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Title:
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CHIP PACKAGE AND FABRICATION METHOD THEREOF
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Assignee
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9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
TAOYUAN COUNTY |
JHONGLI CITY, TAIWAN 32062 |
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Correspondence name and address
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WEN LIU
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444 S. FLOWER STREET, SUITE 1750
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LOS ANGELES, CA 90071
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