Patent Assignment Details
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Reel/Frame: | 033169/0981 | |
| Pages: | 3 |
| | Recorded: | 06/24/2014 | | |
Attorney Dkt #: | 27-919 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/27/2015
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Application #:
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14313452
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Filing Dt:
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06/24/2014
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CORELESS SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
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Assignee
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ISHIMARU & ASSOCIATES LLP
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2055 GATEWAY PLACE
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SUITE 700
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SAN JOSE, CA 95110
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