Patent Assignment Details
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| Reel/Frame: | 051162/0981 | |
| Pages: | 3 |
| | Recorded: | 12/03/2019 | | |
| Attorney Dkt #: | 2867-2480 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/12/2021
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Application #:
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16701698
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Filing Dt:
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12/03/2019
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Publication #:
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Pub Dt:
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04/01/2021
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Title:
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SEMICONDUCTOR CHIP SUITABLE FOR 2.5D AND 3D PACKAGING INTEGRATION AND METHODS OF FORMING THE SAME
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Assignee
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| 7628 THORNDIKE ROAD |
| GREENSBORO, NORTH CAROLINA 27409 |
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Correspondence name and address
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QORVO AND WITHROW + TERRANOVA
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106 PINEDALE SPRINGS WAY
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CARY, NC 27511
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06/05/2024 08:59 PM
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