Patent Assignment Details
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Reel/Frame: | 051337/0981 | |
| Pages: | 4 |
| | Recorded: | 12/19/2019 | | |
Attorney Dkt #: | M1295.70039US06 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/11/2022
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Application #:
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16721475
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Filing Dt:
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12/19/2019
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Title:
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SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE
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Assignee
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NO. 1, DUSING RD. 1ST |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU 300, TAIWAN R.O.C. |
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Correspondence name and address
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WOLF, GREENFIELD & SACKS, P.C.
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600 ATLANTIC AVENUE
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BOSTON, MA 02210
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