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Reel/Frame:037342/0982   Pages: 5
Recorded: 12/21/2015
Attorney Dkt #:100415-0207
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/05/2018
Application #:
14976702
Filing Dt:
12/21/2015
Publication #:
Pub Dt:
06/30/2016
Title:
SEMICONDUCTOR DEVICE WITH METAL-BONDED HEAT DISSIPATOR AND MANUFACTURING METHOD FOR THE SAME
Assignors
1
Exec Dt:
12/17/2015
2
Exec Dt:
12/16/2015
3
Exec Dt:
12/17/2015
Assignee
1
491-100, OKA, KAMINAKA-CHO
ANAN-SHI, TOKUSHIMA, JAPAN 774-8601
Correspondence name and address
FOLEY & LARDNER LLP
3000 K STREET NW
SUITE 600
WASHINGTON, DC 20007

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